FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging
Kaynak gösterimi
D. RAMDAN, C.Y. KHOR, M. ABDUL MUJEEBU, M.Z. ABDULLAH, W.K. LOH and C.K. OOI (2013). FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging. Isı Bilimi ve Tekniği Dergisi, 33(1), 101-109.